NanoEtch by Moorfield: Redefining Etching Nanotechnology at ArabLab 2025

The Middle East is rapidly emerging as a hub for nanotechnology innovation, with the market projected to grow from USD 18.4 billion in 2025 to USD 61.2 billion by 2031. This momentum is supported by government-backed smart city projects, high-tech manufacturing investments, and adoption across sectors such as healthcare, energy, and electronics. Against this backdrop, ArabLab 2025 will take place from 23 to 25 September 2025 at the Dubai World Trade Centre, providing a stage for leading-edge technologies.

BCL is proud to be part of this global gathering. At Stall No. H2-C70, we will present Moorfield Nanotechnology’s NanoEtch system, a nano technology machine that is reshaping how researchers and manufacturers approach etching nanotechnology.

A Closer Look at the NanoEtch

The NanoEtch is designed to unlock the full potential of reactive ion etching, one of the most in-demand techniques in semiconductor and advanced material processing. Compact yet powerful, it delivers precision, uniformity, and process repeatability for both research and production. Its benchtop configuration makes it suited to universities, R&D labs, and industrial facilities, while multi-recipe programming allows repeatability at scale.

Key technical features include:

• Benchtop configuration for accessible, space-efficient use
• Soft etching capability with precision RF power below 30 W
• Up to three MFC-controlled process gases
• Sub-5 × 10?7 mbar base pressures
• Stages supporting up to 150 mm substrates
• Fully automated touchscreen HMI
• PC connectivity for data logging
• Cleanroom compatibility and comprehensive safety features

With the Middle East and Africa semiconductor equipment market valued at USD 1.85 billion in 2024 and forecast to grow at 10.3 percent CAGR through 2033, systems like NanoEtch are arriving at the right time. Dry etch equipment alone generated USD 250.1 million in 2024, with steady growth of 4.1 percent projected from 2025 onwards.

Soft Etching for Sensitive Materials

A defining capability of the NanoEtch is its Soft Etching feature, which is becoming increasingly important as researchers in the region handle delicate nanostructures for microelectronics, MEMS sensors, and next-generation materials. With the ability to apply ultra-low plasma powers below 5 W, and in some cases down to 100 mW, NanoEtch enables controlled etching where standard RIE methods risk damage.

One application is the soft etching of ultra-thin PPA resist layers. Heidelberg Instruments Nano used NanoEtch to reduce the plasma ignition effect to around 1 nm, enabling successful transfers on PPA films thinner than 6 nm. This breakthrough allows higher resolution and reliability for advanced fabrication processes, which is critical as regional universities and R&D labs expand their facilities with new nanofabrication equipment.

Fluorine-Chemistry Etching Applications

Beyond delicate processes, the NanoEtch can also be configured for fluorine-chemistry etching using SF6 or CHF3. This flexibility positions the system strongly in a regional market that is investing in both advanced electronics and sustainable industries.

Recent application examples include:

• h-BN sidewall etching: Controlled removal of 7–8 layers in a two-minute process with SF6, leaving residual roughness of only one atomic layer
• h-BN bulk etching: Achieving depths of 130 nm at rates of 1.1 nm/s
• SiO2 etching: Ultra-low etch rates of approximately 1.3 Å/s with CHF3, offering excellent precision for oxide control
• Si etching: Removal of 25 nm in 20 seconds using SF6 and N2, suitable for high-resolution stack applications

With MEMS, photonics, and IoT devices among the fastest growing sectors in the Gulf, the demand for this type of controlled, reliable etching continues to increase.

About Moorfield Nanotechnology

Moorfield Nanotechnology is a specialist in nano fabrication and thin film deposition systems. Their solutions are widely adopted by universities, research institutes, and industrial manufacturers. Known for precision engineering and innovation, Moorfield has become a trusted name in enabling advanced nanotechnology research. The NanoEtch system reflects this expertise, providing a versatile solution that bridges laboratory-scale experimentation with scalable manufacturing applications.

Why Consider Visiting BCL at ArabLab 2025

ArabLab is not only a showcase but also a meeting ground for decision-makers, researchers, and manufacturers. At Stall No. h3-C70, BCL will provide:

• Live demonstrations of the NanoEtch system in action
• Insight into Soft Etching and fluorine-chemistry applications tailored to regional industries
• Consultations with technical experts on how NanoEtch fits into workflows for microelectronics, MEMS, photonics, and advanced materials research
• A direct look at how this nano technology machine can support the GCC’s ambitions in high-tech manufacturing and sustainable industries

By connecting innovation with practical application, our stall will give visitors a clear sense of how NanoEtch can make an impact in their own projects.

Finally..

Nanotechnology in the Middle East is entering a decisive growth phase, with the market expected to reach USD 61.2 billion by 2031. For researchers and manufacturers, this expansion creates both opportunities and pressures to adopt tools that guarantee accuracy, repeatability, and control at the nanoscale.

The Moorfield NanoEtch delivers exactly that. Its advanced Soft Etching capability, fluorine-chemistry flexibility, and proven reliability make it more than a laboratory asset. It is a platform for driving the next wave of regional innovation.

ArabLab 2025 is your chance to see this transformation in action. Visit BCL at Stall h3-C70 to experience the NanoEtch first-hand, speak with our experts, and discover how precision etching can reshape your workflows in microelectronics, MEMS, photonics, and beyond.

Join us at ArabLab 2025 and explore how Moorfield’s NanoEtch is setting new standards for etching nanotechnology across the Middle East.