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Precision Plasma Etching for Advanced Research
BCL’s Etch Systems are engineered for precision-driven surface modification, offering soft and reactive ion etching (RIE) capabilities for advanced micro and nanofabrication. Ideal for research labs and high-tech industries, these systems support cutting-edge applications involving sensitive materials like graphene, h-BN, and thermally oxidized silicon. Whether you're working at the atomic scale or dealing with challenging materials, our Etch Systems deliver the process control and repeatability needed for today's nanoscale fabrication workflows.
nanoETCH — Benchtop RIE Tool with Soft Etch Capability
Compact Design. Atomic Precision. Big Results.
The nanoETCH is a powerful benchtop reactive ion etching system designed for researchers pushing the limits of nano-fabrication. Compact yet capable, it features both fluorine-based RIE and ultra-low-power soft etch technology, making it a go-to solution for delicate materials like graphene, PPA thermal resist, and h-BN. With programmable gas flow control (up to 3 MFCs), low ignition plasma down to sub-watt levels, and compatibility with aggressive etchants like SF₆ and CHF₃, nanoETCH delivers industry-grade performance in a compact footprint. Perfect for universities, R&D labs, and semiconductor innovators looking for highly controlled and repeatable etch results.
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