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BCL offers a comprehensive range of benchtop Physical Vapor Deposition (PVD) systems designed for high-performance research and thin-film deposition. These compact yet powerful systems—ideal for universities, research labs, and advanced industrial environments—deliver exceptional coating uniformity, process repeatability, and configurability in a cleanroom-compatible benchtop form. Whether your application demands sputtering, evaporation, or a hybrid approach, our benchtop PVD solutions provide the flexibility, automation, and precision needed for next-generation materials development.
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The nanoPVD-S10A is a compact, research-grade benchtop physical vapor deposition (PVD) system optimized for RF and DC magnetron sputtering of both metals and insulating materials such as oxides or nitrides. Designed for substrates up to 4” in diameter, it features up to 3 water-cooled magnetrons for high-power, sustained operation, and a turbomolecular pumping system for ultra-clean deposition environments. Its modular setup supports co-deposition and reactive sputtering using up to three process gases, making it ideal for advanced material development and thin-film research.
The nanoPVD-S10A is ideal for research groups and academic institutions working on advanced material coatings, nanostructured films, and semiconductor device development. It is commonly used for depositing metals, oxides, nitrides, and other compound films for applications in:
The nanoPVD-S10A-WA brings wide-area magnetron sputtering to a benchtop format. Built on the nanoPVD-S10A platform, it is designed for uniform deposition over substrates up to 8" in diameter. This configuration uses an upward-facing magnetron source geometry in combination with substrate rotation and orifice exposure plates for enhanced coverage. Like its standard counterpart, it supports reactive and co-deposition processes with high precision and stability.
Engineered for larger substrates, the nanoPVD-S10A-WA caters to users requiring uniform thin-film coverage across up to 8” wafers. It’s well-suited for:
The nanoPVD-T15A is a high-performance benchtop thermal evaporation system for depositing metals and volatile organic materials. Supporting up to 4" diameter substrates, it features a tall chamber for high aspect-ratio coating and can be fitted with both resistive and low thermal mass LTE evaporation sources. Its low base pressure and in-situ process control make it ideal for uniform, contamination-free deposition in research settings.
The nanoPVD-T15A is designed for precision thermal evaporation of metals and organics, making it the go-to system for sensitive or volatile materials. Typical applications include:
The nanoPVD-ST15A merges magnetron sputtering and thermal evaporation into a single benchtop platform, offering unmatched flexibility for thin-film deposition. Designed for substrates up to 4" in diameter, it accommodates up to three sources of two different types—including LTE, resistive, and magnetron. This versatile tool supports multiple deposition methods in a single run, making it ideal for advanced materials research and multi-layer film development.
The hybrid nanoPVD-ST15A provides unparalleled flexibility, supporting both sputtering and evaporation workflows in one tool. It’s used across multidisciplinary labs working on:
We can help you with a solution tailor to your specific need.